4/3/2023 0 Comments Solder paste for reflow![]() ![]() -1 tin-silver Chemical compound 0.000 claims description 64.229910045601 alloy Inorganic materials 0.000 claims description 88.239000007788 liquid Substances 0.000 claims abstract description 16.150000004706 metal oxides Chemical class 0.000 claims abstract description 24.229910044991 metal oxide Inorganic materials 0.000 claims abstract description 24.239000000463 material Substances 0.000 claims abstract description 28.239000002184 metal Substances 0.000 claims abstract description 50.229910052751 metal Inorganic materials 0.000 claims abstract description 50.239000000843 powder Substances 0.000 claims abstract description 54.238000005476 soldering Methods 0.000 claims abstract description 94.239000000539 dimer Substances 0.000 claims abstract description 108.239000002253 acid Substances 0.000 claims abstract description 110.230000000996 additive Effects 0.000 claims abstract description 130.239000000654 additive Substances 0.000 claims abstract description 144.238000000034 method Methods 0.000 title claims abstract description 56.229910000679 solder Inorganic materials 0.000 title claims abstract description 364.Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.) Filing date Publication date Priority claimed from US57556304P external-priority Application filed by Kay Lawrence C, Munson Terry L, Severin Erik J filed Critical Kay Lawrence C Priority to US11/140,432 priority Critical patent/US20060011267A1/en Publication of US20060011267A1 publication Critical patent/US20060011267A1/en Status Abandoned legal-status Critical Current Links Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.) Abandoned Application number US11/140,432 Inventor Lawrence Kay Terry Munson Erik Severin Original Assignee Kay Lawrence C Munson Terry L Severin Erik J Priority date (The priority date is an assumption and is not a legal conclusion. Google Patents US20060011267A1 - Solder paste and process US20060011267A1 - Solder paste and process ![]()
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